Sensing, modeling, and simulation in emerging electronic packaging presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia

Cover of: Sensing, modeling, and simulation in emerging electronic packaging |

Published by American Society of Mechanical Engineers in New York, N.Y .

Written in English

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  • Electronic packaging -- Congresses.,
  • Multichip modules (Microelectronics) -- Congresses.

Edition Notes

Includes bibliographical references and index.

Book details

Statementsponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Chao-pin Yeh, Charles Ume.
SeriesEEP ;, vol. 17, EEP (Series) ;, vol. 17.
ContributionsUme, Charles., Yeh, Chao-pin., American Society of Mechanical Engineers. Electrical and Electronic Packaging Division., International Mechanical Engineering Congress and Exposition (1996 : Atlanta, Ga.)
LC ClassificationsTK7870.15 .S45 1996
The Physical Object
Paginationv, 125 p. :
Number of Pages125
ID Numbers
Open LibraryOL1020204M
ISBN 10079181548X
LC Control Number96078690

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